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Components Plus offer a broad range of value added services to support your electronic component and manufacturing needs. We offer the quickest turn around time in the industry for component delivery and additional needs you many have. For more detail about how Components Plus support your value added needs contact your C+ representative.

Our value added services include:

Same Day / Next Day Delivery    

Product Sourcing

Cross Referencing & Engineering Support

Tape and Reeling

Electronic Component Testing

Electronic Component Programming
 

Same Day / Next Day Delivery  

·          Through our advanced computerized logistics department and our network of contracted couriers we can deliver the electronic components you need anywhere in the world to you same day, next day, or any time you need them.

Product Sourcing  

  • Over 100,000,000 components available worldwide for immediate delivery
  • Access to over 25,000 supplier inventories worldwide
  • Access to Factory stock, Franchised stock, OEM Excess, CEM Excess, and worldwide supplier inventories
  • Complete Vendor quality systems insuring quality product with on-time deliveries
  • ISO compliant warehousing insure quality products delivered
  • Full ESD Protection
  • 100% Visual Incoming Inspection
  • 100% Count Verification

Cross Referencing & Engineering Support

  • Our inhouse engineering staff support datasheet access, equivalents, cross referencing, and upgrades for all your component needs .

Tape and Reeling  

  • Surface Mount, SOIC, SOJ, PLCC, QSOP, TSOP,QFP,
    SOT & BGA.
  • Radial Tape and Reel
  • Axial Tape and Reel
  • De-Tape
  • Lead Forming and Trimming
  • Full ESD Protection
  • 100% Visual Incoming Inspection
  • 100% Count Verification

Electronic Component Testing  

  • Mil Spec - 883
  • Humidity Test
  • Industrial Temperature Testing
  • Lead Forming
  • Marking
  • Recertification
  • Reliability Testing
  • Commercial Testing
  • Power Burn-In
  • Custom IC & Transistor Packaging
  • Immersion
  • Solderability Testing
  • Capacitance Testing
  • Equivalent screening for JAN thru JANS
  • Environmental Stress Screening
  • Burn-in Testing to +200 Deg C

Electronic Component Programming  

  • Memory
  • Microcontrollers including FGPA, PROM, EPROM, Flash
  • Logic including PLD & CPLD
  • All package types including but not limited to BGA, DIP, QFP, PLCC, TSOP, SOIC